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 DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
M3D121
BYD1100 Hyper fast soft-recovery rectifier
Product specification Supersedes data of 1998 Dec 03 1999 Nov 16
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Smallest surface mount rectifier outline * Shipped in 8 mm embossed tape.
MAM061
BYD1100
and fatigue free as coefficients of expansion of all used parts are matched.
(1) Implotec is a trademark of Philips.
DESCRIPTION Cavity free cylindrical glass package through ImplotecTM(1) technology. This package is hermetically sealed
handbook, 4 columns
k
a
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM VR IF(AV) PARAMETER repetitive peak reverse voltage continuous reverse voltage average forward current Ttp = 55 C; averaged over any 20 ms period; see Figs.2 and 4 Ttp = 110 C; averaged over any 20 ms period; see Figs.2 and 4 Tamb = 60 C; printed-circuit board mounting, see Fig.12; averaged over any 20 ms period; see Figs.3 and 4 IFRM IFSM Tstg Tj repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature Ttp = 105 C; see Fig.6 Tamb = 60 C; see Fig.7 t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax CONDITIONS MIN. - - - - - MAX. 100 100 2.7 1.7 V V A A UNIT
0.85 A
- - - -65 -65
16 8 15 +175 +175
A A A C C
1999 Nov 16
2
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF V(BR)R IR PARAMETER forward voltage reverse avalanche breakdown voltage reverse current CONDITIONS IF = 1 A; Tj = Tj max; see Fig.5 IF = 1 A; see Fig.5 IR = 0.1 mA VR = VRRMmax; see Fig.8 VR = VRRMmax; Tj = 165 C; see Fig.8 trr reverse recovery time when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig.10 f = 1 MHz; VR = 0; see Fig.9 when switched from IF = 1 A to VR 30 V and dIF/dt = -1 A/s; see Fig.11 MIN. - - 120 - - - TYP. - - - - - -
BYD1100
MAX. 0.735 V 0.96 - 5 150 10 V V
UNIT
A A ns
Cd dI R -------dt
diode capacitance maximum slope of reverse recovery current
- -
70 -
- 2
pF A/s
THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.12. For more information please refer to the `General Part of associated Handbook'. PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS VALUE 30 150 UNIT K/W K/W
1999 Nov 16
3
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
GRAPHICAL DATA
MGR567
BYD1100
MGR566
handbook, halfpage
4
handbook, halfpage
2.0
IF(AV) (A) 3
IF(AV) (A)
1.6
1.2 2 0.8
1 0.4
0 0 40 80 120 160 200 Ttp (C)
0 0 40 80 120 160 200 Tamb (C)
Switched mode application. a = 1.42; = 0.5; VR = VRRMmax.
Switched mode application. a = 1.42; = 0.5; VR = VRRMmax. Device mounted as shown in Fig.12.
Fig.2
Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage).
Fig.3
Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage).
handbook, halfpage
2.0
MBK899
MGR563
P (W) 1.6
a=3
2.5 2
1.57 1.42
handbook, halfpage
20
IF (A)
16
1.2
12
0.8
8
0.4
4
0 0 0.4 0.8 1.2 1.6 2.0 IF(AV) (A)
0 0 1 2 3 VF (V) 4
a = IF(RMS)/IF(AV); = 0.5; VR = VRRMmax.
Fig.4
Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current.
Dotted line: Tj = 175 C. Solid line: Tj = 25 C.
Fig.5
Maximum forward voltage as a function of forward current.
1999 Nov 16
4
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
BYD1100
handbook, full pagewidth
20
MGR571
IFRM (A) 16 = 0.05
12 0.1
8
0.2
4
0.5 1
0 10-2
10-1
1
10
102
103
tp (ms)
104
Ttp = 105 C; Rth j-tp = 30 K/W; VR = VRRMmax during 1 - ; curves include derating for Tj max at VRRM = 100 V.
Fig.6 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
handbook, full pagewidth
10
MGR570
IFRM (A) 8 = 0.05
6 0.1
4
0.2
2
0.5 1
0 10-2
10-1
1
10
102
103
tp (ms)
104
Tamb = 60 C; Rth j-a = 150 K/W; VR = VRRMmax during 1 - ; curves include derating for Tj max at VRRM = 100 V.
Fig.7 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1999 Nov 16
5
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
BYD1100
103 handbook, halfpage IR (A) 102
MGC550
103 handbook, halfpage Cd (pF) 102
MBK900
10
10
1 0 100 Tj (C) 200
1
1
10
VR (V)
102
VR = VRRMmax.
f = 1 MHz; Tj = 25 C.
Fig.8
Reverse current as a function of junction temperature; maximum values.
Fig.9
Diode capacitance as a function of reverse voltage; typical values.
handbook, full pagewidth
DUT
IF (A) 0.5 t rr
0.5 A
50
0 0.25 0.5 IR (A) 1.0
t
MAM282
Rise time oscilloscope: tr 2 ns. Turn-on time switch: t 3 ns.
Fig.10 Test circuit and reverse recovery time waveform and definition.
1999 Nov 16
6
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
BYD1100
IF handbook, halfpage dI F dt t rr 10% t dI R dt 100% IR
MGC499
50
4.5 50 2.5
1.25
MSB213
Dimensions in mm.
Fig.11 Reverse recovery definitions.
Fig.12 Device mounted on a printed-circuit board.
1999 Nov 16
7
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
PACKAGE OUTLINE Hermetically sealed glass surface mounted package; ImplotecTM(1) technology; 2 connectors
BYD1100
SOD87
k
(2)
a
D1
D
L DIMENSIONS (mm are the original dimensions) UNIT mm D 2.1 2.0 D1 2.0 1.8 H 3.7 3.3 L 0.3 H
L
0
1 scale
2 mm
Notes 1. Implotec is a trademark of Philips. 2. The marking indicates the cathode. OUTLINE VERSION SOD87 REFERENCES IEC 100H03 JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-03-31 99-06-04
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Nov 16
8
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
NOTES
BYD1100
1999 Nov 16
9
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
NOTES
BYD1100
1999 Nov 16
10
Philips Semiconductors
Product specification
Hyper fast soft-recovery rectifier
NOTES
BYD1100
1999 Nov 16
11
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
135002/02/pp12
Date of release: 1999
Nov 16
Document order number:
9397 750 06266


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